| < Silicon wafers > |
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| < Compound semiconductor wafers > | |
| < Oxide wafers > | |
| < Other materials > | |
| < Metals > |
Business Activities
Precision polishing and cleaning of semiconductor materials, oxides, optical materials and metals
| < Silicon wafers > |
|
| < Compound semiconductor wafers > | |
| < Oxide wafers > | |
| < Other materials > | |
| < Metals > |
In the field of electronics, customers' needs are being met with such materials as silicon, oxides and compound semiconductors.
NIHON-EXCEED takes on the polishing of all materials related to our technology, always delivering high-level products.
NIHON-EXCEED has gained trust with its products of incomparable precision and quality, and its original technology, from mounting to polishing and cleaning.
CONTACT sales@nihon-exceed.co.jp TEL +81-297-27-1531 FAX +81-297-27-2181
Silicon wafers have been widely used for the substrate of LSI, ULSI, etc.
For the degree of flatness of the wafer surface, angstrom- level mirror polishing is demanded. This precision technology is effective in increasing product acceptability rates. (Return)Materials : Silicon wafers of various diamaters
Compound semiconductors are mainly used for LED or LD. These materials (GaAs, GaP, etc.) are so delicate that they are polished by optimized chemical- solutions. (Return)
Materials : GaP, GaAs, GaSb, InP, InAs, InSb, ZnS, ZnSe, etc.
Oxide (LiNbO3, LiTaO3, etc.) have been used for surface acoustic wave (SAW) filter or the parts in a handy telephone. Recently, we have started the polishing of sapphire wafers which is used for the substrates of nitride semiconductors for blue-to-green light emitting diodes (LED) and laser diodes (LD). (Return)
Materials : LiNbO3, LiTaO3, Crystal, Sapphire, etc.
We can polish magnetic materials, superconductors, silicon electrodes and rings for plasma etching equipment, new other materials, etc. (Return)
Materials : Ge, SiC, C, MnZn-ferrite, TeO2, SrTiO3, LaGaO4, La3Ga5SiO14, LaSrGaO4, InSnO, NdGaO3, Y2Fe5O12, Y3Al5O12, Bi12GaO20,
Silicon electrodes and rings for plasma etching equipment, etc.
Moreover, we are performing trial production machining of metal material with the technology adapting optical polish technology. This technology is used in the various fields of vacuum equipment and gas related equipment. (Return)
Materials : SUS, Au, Ag, Cu, W, Ti, Al, etc.