Inspection before polishing

• Measurement of thickness
• Batch formation

Mounting

• Coated wax on reverse of wafers
• Mounted wafers on the polishing plate

1 st polishing

• High efficiency
• Make into mirror surfaces
• Removal of surface damage

2 nd polishing

• OSF free
• Improvement of surface roughness（1-3nmRy）

Final polishing

• Haze free
• Removal of surface contamination

Cleaning

• Removal of particle, organic, inorganic substance and heavy metal contamination

Cleaning method :

• Alkaline solution
• Acid solution
• Ultra-pure water

Drying method :

• Spin Dryer
• Vapor Dryer

Inspection

• Dark field of vision in the clean room, The use of halogen lighting

Surface inspection :

• Micro-scratch
• Haze
• Particle
• etc.

Measurement :

• Thickness
• Flatness
• PN
• Resistance